Silicon Analysts

Returns 13 specific AI accelerators (H100/H200/B100/B200/GB200, MI300X/MI355X, Gaudi 3, TPU v5p, Trainium 2, Maia 100, MTIA v2) with structured fields: chip, vendor, processNode, dieSizeMm2, memoryType, memoryCapacityGb, memoryBandwidthTbS, fp8TflopsSparse, bf16TflopsDense, packageType, estMfgCostUs

Pure-function chip cost estimator. Given die dimensions (mm), process node, and optional packaging/HBM parameters, returns: estimatedChipCost (USD), dieArea (mm²), grossDiesPerWafer, frontendYield (%), totalYield (%), and a costBreakdown {waferCostPerGoodDie, packagingAndTestCost, hbmCost, marginCos

Heuristic chip manufacturing LEAD TIME estimator (MANUFACTURING CYCLE TIME). Given total mask layers (or a processNode to default them), foundry utilization % (optional — defaults from live foundry-allocation data), and packagingType, returns min/max bands: fabDays, fabWeeks, packagingWeeks, totalWe

Returns 10 HBM market sub-tables: accelerators, specs, marketShare, spotPrices, leadingIndicators, qualificationFeed, revenueForecast, supplierRevenue, validationChecks, bitDemand. Optional `table` parameter narrows to a single sub-table; omitting returns all 10. USE THIS for: HBM3/3e/4 generation

Returns curated supply-chain headlines with trend direction (up/down/neutral), source attribution, and impact analysis. Categories: logic, memory, packaging, connectivity, power, geopolitics. Defaults to all categories, all trends, no limit. USE THIS for: "what's happening in HBM this quarter?", "a

Returns 300mm wafer price ranges (min/avg/max USD), defect density, NRE/mask-set cost, and node maturity for: tsmc-n3, tsmc-n5, tsmc-n7, tsmc-28, samsung-3nm, samsung-5nm, intel-16. Optional `node` filter narrows to one. USE THIS for: looking up wafer cost for cost modeling, comparing foundries at

Returns two sub-arrays: `packaging` (per-tech cost benchmark + capability matrix for CoWoS-S/L, EMIB, SoIC, InFO-PoP, FC-BGA, FC-CSP, etc.) and `hbmSpecs` (HBM2 through HBM4 cost per stack + bandwidth/capacity). Optional `type` filter narrows packaging array to one technology. USE THIS for: packagi

Sourced HBM qualification tracker: which memory vendor (SK Hynix, Samsung, Micron) passed which AI-accelerator customer's qualification (NVIDIA Vera Rubin/GB300/B300/H200, AMD MI350/MI325X, Broadcom), by generation (HBM3/HBM3E/HBM4) and stack height. Returns `matrix` (current status per vendor×custo

Foundry & advanced-packaging ALLOCATION — the current-state snapshot per node/tech (TSMC/Samsung/Intel/... × N2/N3/CoWoS-L/SoIC/...) plus optional time-series HISTORY. Current fields: allocation_status (fully_booked → available), lead_time_weeks_min/max + trend, utilization, price_trend, geo_risk, c

Foundry IR ECONOMICS — per-foundry, per-process-node, per-fiscal-quarter wafer ASP (min/max/blended, USD per 300mm-equivalent wafer, $250-grained) and fab UTILIZATION (%), derived exclusively from PUBLIC IR materials (earnings releases/transcripts/decks, trade press) via a documented scaling calcula

"What Changed" — recent MOVEMENTS in Silicon Analysts' public data over a 7d/30d window, derived from the daily snapshot ledger. Each moved metric returns direction (up/down), magnitude (pct_delta for value metrics, pp_delta for percentage metrics), old/new values, the two snapshot dates compared (a

Curated market-data TIME SERIES with per-point sourcing — the datasets behind siliconanalysts.com/market-data. Includes: hbm-pricing (HBM contract + blended $/GB by generation, HBM2→HBM4, anchors 2017→2026 — series_keys like 'hbm3e-contract'; NOTE: no public HBM spot market exists — HBM sells via LT

Market Intelligence — the freshest SOURCED semiconductor market briefs, generated daily from a Tavily + Claude scan of primary press, earnings, and trade outlets. Each brief returns title, severity (Critical/High/Medium/Low), confidence_score (0-100), quantitative_impact (e.g. "Est. BOM increase: +$

Market Advantage — human-vetted TIME-ADVANTAGE evidence: dated, immutable proof that Silicon Analysts recorded a semiconductor supply-chain event BEFORE the first English-language coverage of it. For each win: our first-seen timestamp (immutable), the cited source's own publication time, the first E

Historical Benchmarks — the bitemporal benchmark-observations ledger behind the Chip Cost Calculator: wafer cost by node/foundry (deflationary curves), defect-density (D0) learning curves per node, advanced-packaging costs incl. the broken-out CoWoS interposer entity, test cost, backend yield, and H

Fab Capacity — per-fab, per-tech-node-class capacity from the fabs + fab_capacity_snapshots time-series (65 fabs: TSMC, Samsung, Intel, SMIC, GlobalFoundries, and more; Frontend in kwspm, Backend advanced-packaging in k units/month). Default mode returns the LATEST state per (fab, node class) at/bef

Forecast Vintages — third-party forecasts (research firms like TrendForce/WSTS/SEMI, and company capex/bit-growth guidance) archived with their ORIGINAL publication date. Query the REVISION HISTORY, not just the latest number: "what did TrendForce say about 2026 HBM bit growth in January vs July?".

WFE Order-Book — wafer-fab-equipment maker disclosures (ASML, Applied Materials, Lam Research, KLA, Tokyo Electron) from quarterly IR: bookings, backlog, segment revenue, and guidance, in the STATED currency (EUR for ASML, JPY for TEL, USD for the rest — never converted). The 12–24-month leading ind

Fab Milestones — the dated construction & ramp event log: announcement → groundbreaking → equipment move-in → risk production → HVM, plus expansions and SCHEDULE SLIPS recorded as their own events (a delay never overwrites the original plan). Back to 2020. Each row: foundry, fab_name, event_type, ev

Trade-Policy Timeline — the dated log of semiconductor trade-policy actions (export controls, entity listings, license policies, tariffs, subsidies, retaliation) anchored to GOVERNMENT PRIMARY documents (Federal Register / BIS, USTR, MOFCOM, METI, EU, Netherlands…), back to the Oct 2022 BIS advanced